ULTRA LOW TEMP FLUX CORED CHIP RIn StockRoHS / Compliance

REM2.7-ULTRA-NL

ULTRA LOW TEMP FLUX CORED CHIP R

Series
CHIPQUIK®
Process
Lead Free
Flux Type
No-Clean, Water Soluble
Packaging
Bulk
Datasheet (PDF)

Professional Packaging

Original Packaging

Factory sealed, ESD anti-static tray

Desiccant Protection

Humidity indicator card & silica gel included

Vacuum Sealing

Moisture barrier bag, nitrogen filled

Secure Boxing

Anti-vibration foam, shock-proof labeling

ParameterValue
CategorySolder
ManufacturerChip Quik Inc.
Form-
Type-
SeriesCHIPQUIK®
Weight-
ProcessLead Free
Diameter-
Flux TypeNo-Clean, Water Soluble
Mesh Type-
PackagingBulk
Shelf Life-
Wire Gauge-
Composition-
Part StatusActive
ManufacturerChip Quik Inc.
Melting Point144°F (62°C)
Shipping Info-
Shelf Life Start-
Storage/Refrigeration Temperature-
Package
-
MSL
-

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